国家/地区 Usa(25) India(23) Iran(7) China(6)
Korea(5) Belgium(4) Japan(2)
关键词 INTERCONNECT(79)
出版物 IEEE TRANSACTIONS O.(10) IEEE ELECTRON DEVIC.(9) IETE JOURNAL OF RES.(4)
JOURNAL OF CIRCUITS.(4) IEEE TRANSACTIONS O.(3) MICROELECTRONIC ENG.(3)
MICROELECTRONICS RE.(3) CIRCUIT WORLD(2) IEEE JOURNAL OF THE.(2)
IEEE TRANSACTIONS O.(2) INTERNATIONAL JOURN.(2) JAPANESE JOURNAL OF.(2)
JOURNAL OF COMPUTAT.(2) JOURNAL OF COMPUTAT.(2) MATERIALS RESEARCH .(2)
出版时间 2011(8) 2012(8) 2017(8) 2021(8) 2016(7) 2014(5) 2019(5) 2022(5) 2010(4) 2013(4) 2018(4) 2020(4) 2023(3) 2015(2)
机构 ASSAM UNIV(4) GEORGIA INST.(3) INDIAN INST .(3) MIT(3)
SUNY ALBANY(3) STANFORD UNI.(3) UNIV CALIF R.(3) UNIV CALIF S.(3)
HALDIA INST .(2) ISLAMIC AZAD.(2) KATHOLIEKE U.(2) SOUTH CHINA .(2)
作者 DAS D(8) RAHAMAN H(8) BHATTACHARYA.(6) ASSELBERGHS .(4)
BANERJEE K(4) KONG J(4) LEE KJ(4) NAEEMI A(4)
TOKEI Z(4) WONG HSP(4) YU B(4) AGRAWAL S(3)
CHANDRAKASAN.(3) CHEN XY(3) HAMEDANI SG(3) KAUSHAL G(3)
MOAIYERI MH(3) RAI MK(3) SAHOO M(3) SOREE B(3)

INTERNATIONAL JOURNAL OF NUMERICAL MODELLINGELECTRONIC NETWORKS DEVICES FIELDS

DAS D

NATIONAL ACADEMY SCIENCE LETTERSINDIA

DAS S, BHATTACHARYA S, DAS D, RAHAMAN H

MATERIALS SCIENCE ENGINEERING BADVANCED FUNCTIONAL SOLIDSTATE MATERIALS

MITTAL J, LIN KL

IEEE TRANSACTIONS ON ELECTRON DEVICES

NASHED R, PAN CY, WU XY, ASSELBERGHS I, TOKEI Z, CATTHOOR F, NAEEMI A

2D MATERIALS

DU W, AHMED Z, WANG Q, YU C, FENG ZH, LI GY, ZHANG M, ZHOU CJ, SENEGOR R, YANG CY

JOURNAL OF CIRCUITS SYSTEMS COMPUTERS

PATEL N, AGRAWAL Y