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KOO K, DAE KS, HAHN YK, YUK JM
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TINCU B, AVRAM M, AVRAM A, TUTUNARU O, TUCUREANU V, MATEI A, BURINARU T, COMANESCU F, DEMETRESCU I
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FESTINGER N, MORAWSKA K, IVANOVSKI V, ZIABKA M, JEDLINSKA K, CIESIELSKI W, SMARZEWSKA S
IEEE TRANSACTIONS ON COMPONENTS PACKAGING MANUFACTURING TECHNOLOGY
ZHU Y, TAN CW, CHUA SL, LIM YD, VAISBAND B, TAY BK, FRIEDMAN EG, TAN CS
IEEE SENSORS JOURNAL
MORSY M, IBRAHIM M, YUAN ZY, MENG FL
POLYMER COMPOSITES
AHMED J, LUCIANO G, MAGGIORE S
IEEE SENSORS JOURNAL
DEHDASHTIAN S, HASHEMI B, CHEGENI M, AEENMEHR A
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BOURCHAK M, NAHAS MN, KADA B, KHAN AN, ALGARNI A, JUHANY KA