THIN SOLID FILMS

TREPALIN V, ASSELBERGHS I, BREMS S, HUYGHEBAERT C, RADU I, AFANAS EV V, HOUSSA M, STESMANS A

ACS NANO

VELPULA G, PHILLIPSON R, LIAN JX, CORNIL D, WALKE P, VERGUTS K, BREMS S, UJII H, DE GENDT S, BELJONNE D, LAZZARONI R, MALI KS, DE FEYTER S

ADVANCED MATERIALS INTERFACES

SCHEERDER JE, LIU SL, ZHARINOV VS, RECKINGER N, COLOMER JF, CHENG HP, VAN DE VONDEL J, JANSSENS E

IEEE ELECTRON DEVICE LETTERS

CONTINO A, CIOFI I, WU XY, ASSELBERGHS I, CELANO U, WILSON CJ, TOKEI Z, GROESENEKEN G, SOREE B

ACS APPLIED MATERIALS INTERFACES

VERGUTS K, SCHOUTEDEN K, WU CH, PETERS L, VRANCKEN N, WU XY, LI Z, ERKENS M, PORRET C, HUYGHEBAERT C, VAN HAESENDONCK C, DE GENDT S, BREMS S

MICROELECTRONIC ENGINEERING

WU XY, ASSELBERGHS I, POLITOU M, CONTINO A, RADU I, HUYGHEBAERT C, TOKEI Z, SOREE B, DE GENDT S, DE FEYTER S, HEYNS M

MICROELECTRONIC ENGINEERING

POLITOU M, ASSELBERGHS I, SOREE B, LEE CS, SAYAN S, LIN D, PASHAEI P, HUYGHEBAERT C, RAGHAVAN P, RADU I, TOKEI Z, DE GENDT S, HEYNS M