国家/地区 中国（4）
IPC部 C（4） H（3）
IPC大类 C08（4） C09（2） H01（2）
H05（2）
IPC小类 C08G（4） C08K（3） C08L（3）
C08J（2） C09D（2） H05K（2）
IPC C08G073/06（4）
发明人
公开年 2018（4）
申请年 2017（4）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparing polymer conductive composite hydrogel involves adding pyrrole monomer in graphene oxide aqueous solution, stirring and dispersing by ultrasonic wave to form solution, adding ferrous salt and hydrogen peroxide solution.

HAN Y, LI T, LI W, WANG T, GAO X, ZHANG Z, SONG H, ZHANG C

Preparing graphene/polypyrrole/carbon black conductive ink comprises e.g. mixing carbon black and graphene/polypyrrole composite material, grinding, mixing mixed conductive filler with sodium carboxymethyl cellulose and ultrasonicating.

XU C, CHEN Y, MEI C, LIAN H, GUO L, WANG X, FENG Q, WEI J

Preparing graphene oxide-coated silk composite material involves preparing dopamine tris-hydrochloric acid buffer to adjust pH value, soaking Salix Cellulose in buffer at room temperature, then repeated washing with deionized water.

QIAN Y, ZHAO B