国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） B29（2） H01（2）
IPC小类 C08K（3） C08L（3） B29C（2）
C08J（2） H01L（2）
IPC C08L083/05（3）
发明人 REN Z（3）
公开年 2021（2）
申请年 2021（3）
专利权人 GUANGDONG SU.（3）

Preparing oriented thermally conductive sheet, comprises e.g. placing prepared fluid composition in orientation molding device, applying high-speed shearing force layer by layer and orienting thermally conductive filler to form continuous multi-layer assembly, then thermally curing, and slicing.

HE C, LIAO X, WANG H, WU P, REN Z

Preparing directional heat conducting sheet used for semiconductor radiating device, by placing fluid composition in orientation forming device, applying high-speed shear force, orienting filler in composition in shear direction to form thin-layer composition, collecting in mold, curing and slicing.

REN Z, WANG H, REN Z M

Compact heat-conducting silica gel composite material based on three-dimensional frame work structure of foam metal useful for inhibiting curing reaction comprises powder,two-component silicone oil,inhibitor and catalyst.

YU X, LI J, REN Z, WANG H