国家/地区 中国（4）
IPC部 C（5） B（3） H（2）
IPC大类 C25（5） C01（2）
IPC小类 C25D（5） C01B（2）
IPC C25D005/50（5）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Method of preparing anode electrophoresis paint mediated electrochemical assembling graphene radiating layer, involves performing thermal reduction treatment to obtain anode electrophoretic paint mediated electrochemical assembling graphene radiating layer.

ZHAO W, JIANG Y, WENG Y, DENG Y

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y