国家/地区 中国（3）
IPC部 H（3）
IPC大类 H05（3） H01（2）
IPC小类 H05K（3） H01L（2）
IPC H05K001/02（2） H05K001/11（2） H05K001/18（2）
H05K003/00（2）
发明人
公开年 2021（3）
申请年 2021（3）
专利权人 AT S AUSTRIA TECHNOLOGIES SYSTEM TEC（3）

Magnetic element used for manufacturing component carrier, comprises substantially annular structure, non-magnetic matrix, and magnetic particles embedded in matrix and matrix is electrically insulating, where matrix is diamagnetic and comprises one of temperature stable polymer.

SALKOVIC I, WEIS G, WEIDINGER G

Method for manufacturing component carrier e.g. printed circuit board, involves creating blind hole in stack towards embedded component, and extending blind hole by etching to expose surface portion of embedded component.

TUOMINEN M, TAY S K, ZHENG X

Component carrier useful as printed circuit board, comprises stack comprising electrically conductive layer structures and electrically insulating layer structure, back-drill hole, and etching neck connecting back-drill hole with end portion of vertical through-connection.

SEBASTIAN L, KASTELIC M, MARKUS K, LACKNER S