国家/地区 中国（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09K（3） C09D（2） C09J（2）
IPC C09J011/04（2） C09K005/06（2） C09K005/14（2）
发明人 LIU Q（6）
公开年 2023（6）
申请年 2022（6）
专利权人

Processing of high thermal conductivity nano composite material for refrigeration, involves using complexing product of particle artificial diamond powder, large particle artificial diamond powder, silver powder, hydrogen iodide solution, and pure aluminum block.

SUN K, LIU H, LIU Q, MA R, PAN Q

Preparing conjugated heat transfer modified cellulose heat conducting glue for preparing heat-conducting enhanced tobacco sheet, tobacco shred or heating cigarette, comprises e.g. mixing conjugating heat conducting material with soluble cellulose, granulating, and concentrating.

LIU J, HUANG Z, WANG P, LU L, LIU Q, LI D

Anticorrosion primer used in ductile iron castings for wind power generators, comprises epoxy resin, novolac epoxy resin, bisaminoalkoxysilane, graphene, carbon nanotube, zinc base, fumed silica, additive, solvent, phenalkamide curing agent and 2,4,6-tris(dimethylaminomethyl) phenol.

YANG L, ZHOU B, REN W, DU C, LIU Q

Preparation of flexible flame-retardant shaped phase change material involves adding phase change matrix, supporting material and heat conducting reinforced material to obtain material, adding curing agent, catalyst and silane coupling agent to obtain flexible coating, coating and curing.

LIU Q, CHENG W

Graphene modified single component sealing glue useful for bonding glass, metal and ceramic comprises methyl phenyl vinyl silicone base rubber, methyl phenyl vinyl silicone oil, platinum catalyst, phenyl hydrogen containing silicone oil, silicon rubber heat stabilizer and vacuumizing and dehydrating.

WU Y, FU Y, LIU Q, NIE B, WANG Y, LV P, ZHANG Z

Highly thermally conductive sizing phase-change material comprises phase-change substrate and cladding material that coats phase-change substrate, phase change substrate comprising resin matrix, thermally conductive filler, cladding material has three-dimensional interpenetrating network structure.

ZHANG J, CHENG X, ZENG M, CHAI J, LIU Q