国家/地区 美国（6）
IPC部 B（6）
IPC大类 B32（6） C01（3） C09（2）
H05（2）
IPC小类 B32B（6）
IPC B32B009/00（3） B32B007/12（2） B32B015/04（2）
B32B037/12（2） C01B032/182（2） H05K003/46（2）
发明人 ATIAS B（2） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LEVI A（2） LIPP E（2）
MENTOVICH E（2） NAVEH D（2） ROTEM Y（2）
公开年 2022（6）
申请年 2022（6）
专利权人 MELLANOX TEC.（2） PCB TECHNOLO.（2） UNIV BARILAN（2）

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Thermoplastic rubber comprises crosslinked network of end-of-life tire-derived rubber and at least one complementary polymer, where polymeric matrix encapsulates at least carbon black particles or graphene particles, and thermoplastic rubber is in form of radiation shielding material.

COE W B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Metal-graphene composite comprises metal layer and graphene layer provided by growing directly on one surface of metal layer, where graphene layer contains two and/or more graphene thin, metal layer is copper, nickel, cobalt, iron, manganese, chromium, vanadium, titanium, platinum, gold and aluminum.

KIM D J, HONG B H, WOO Y S, KIM D, YU Y S

Photomask used in semiconductor industry, comprises substrate, and polymer layer over surface of substrate, where polymer layer comprises thermoplastic polymer and hydrophobic layer, and thermoplastic polymer is set between hydrophobic layer and surface of photomask.

LIN C, WEN C, LIU T H

Universal barrier system used to form moisture shield and thermal break in building, has universal barrier tape made from polyethylene film, universal barrier components and universal barrier edging having polyethylene film base material.

GARCIA J