国家/地区 中国（7）
IPC部 B（7）
IPC大类 B32（7） H05（2）
IPC小类 B32B（7）
IPC B32B009/00（5） B32B009/04（4） B32B009/02（2）
B32B015/20（2） B32B027/02（2） B32B027/12（2）
B32B027/34（2） B32B027/36（2） B32B033/00（2）
B32B038/00（2）
发明人 WANG X（7）
公开年 2022（7）
申请年 2022（7）
专利权人

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Infrared stealth system compatible with electrovariable emission rate and radiation heat dissipation for infrared stealth of high-temperature target, comprises layered structure, from bottom to top sequentially conductive layer, isolation layer, graphene thin film layer and dielectric layer.

ZENG F, TIAN X, LI Y, WANG X, XU K, WANG P, SU J, DING P

Antibacterial and anti-ultraviolet high-efficiency low-resistance micro-nano fiber mask fabric in textile field, comprises inner layer, middle layer and outer layer, where inner layer is hydrophilic layer, middle layer is nanofiber film containing photocatalytic composite antibacterial agent.

HENG C, TANG X, DONG X, BIAN L, WANG X, JIA L

System for preventing and repelling mosquito and insect based on biological control of livestock comprises leg bundling cylinder connected to bottom of dog robe through zipper, backrest mosquito repelling surface layer and abdomen anti-mosquito surface layer connected to top and bottom of robe.

HUANG J, WANG X, CHEN H

Sun-shading wearable terylene cloth, has scattering layer set to change double-layer tissue, scattering layer woven by light-shielding wearable yarn, and supporting layer formed by knitting high-strength ventilating yarn.

WANG X, WANG H, SHEN R

Medical antistatic fabric for e.g. mask, has base layer formed between inner layer and outer layer, where base layer is made of film material, inner layer is made of cotton fabric, and outer layer is made of textile fabric.

SONG M, LI H, WANG X

Preparing high heat-conducting copper-clad plate useful in electronic device, comprises e.g. polishing and coarsening each plane of copper and aluminum plate, coating obtained heat conducting colloid, bonding copper plate to obtain composite plate with three-layer sandwich structure and drying.

CHE Y, FU C, WANG X