国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3） C08（2）
IPC小类 C09J（3）
IPC C09J163/00（3）
发明人
公开年 2023（3）
申请年 2023（3）
专利权人

Heat-conducting adhesive film useful for electronic module, comprises e.g. epoxy resin, epoxy resin curing agent, film-forming resin, ethylene glycol diglycidyl ether, silicon micropowder, glass powder, nano-dioxide, quartz powder, aluminum nitride, silicon nitride and graphene oxide.

XU J, HUANG Z, QI F, ZOU W, PENG T

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Conductive adhesive useful in IGBT module chip, comprises lignin-based epoxy resin, modified graphene and curing agent; lignin-based epoxy resin is obtained by polymerization of hydroxylated lignin and epoxy resin, modified graphene is obtained by treating carbon materials with coupling agent.

LIAO G, DUAN J