国家/地区 中国（2）
IPC部 H（3）
IPC大类 H01（2） H05（2）
IPC小类 H01L（2） H05K（2）
IPC H01L023/373（2） H05K007/20（2）
发明人 WANG H（3）
公开年 2022（3）
申请年 2021（3） 
专利权人 CTRON ADVANCED MATERIAL CO LTD（3）

Heat conducting structure for electronic device, has structure layer which is set on heat conducting metal layer, and is stack structure formed by graphene layer and ceramic material layer.

HUANG H, HUANG J, HE M, WANG H

Thermally conductive structure for use in electronic device, has thermally conductive metal layer having first and second surface opposite first surface, first carbon nanotube layer arranged on first surface metal layer, and ceramic protective layer arranged on first carbon nanotube layer.

HUANG H, HUANG J, HE M, WANG H

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H