国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（2）
IPC小类 C08K（2） C08L（2）
IPC C08L083/04（2）
发明人 REN L（3）
公开年 2021（2）
申请年
专利权人 SHENZHEN ADVANCED ELECTRONIC MATERIAL（3）

Hybrid modification of thermal conductive powder used for thermal interface material includes dispersing silane coupling agent modified mixed liquid in thermal conductive powder and dispersing silane coupling agent modified mixed liquid in modified heat-conducting powder.

ZENG X, HE B, WEN Z, PANG Y, XU Y, REN L

Polymer composite thermal interface material comprises crosslinking agent, lipoic acid and/or derivative, thermal conductive filler and aluminum salt.

REN L, WANG Z, YE W, ZENG X, SUN R, XU J

Preparation of thermal interface materials involves immersing graphite powder in acidic aqueous solution, grafting, mixing with e.g. thermosetting resin, applying on release film, peeling, pressing, cutting, and curing.

ZENG X, SUN R, XU J, DENG F, XIN P, REN L, ZHANG C, YE Z