国家/地区 德国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 KADAU K（2）
公开年 2013（3）
申请年 2011（2） 
专利权人 SIEMENS AG（3）

Electronic circuit arrangement for use in e.g. lamp module, of motor car, has electrically interconnected component coupled to contact element on carrier by connector, where connector and/or contact element is formed from graphene.

WEIDNER K

Component e.g. high temperature operating element such as turbine blade has graphene layer which is directly arranged on substrate made of nickel-or cobalt-based superalloy, and metallic protective layer is formed on substrate.

CLOSSENVON LANKEN SCHULZ M, KADAU K

Microchip for use in computer, comprises heat dissipating enclosure containing graphene which is embedded into wrapping material and graphene structures that are grown on material of microchip which is wrapped with graphene structure.

CLOSSENVON L S M, KADAU K