国家/地区 中国（4）
IPC部 C（4）
IPC大类 C09（2）
IPC小类
IPC
发明人
公开年 2023（3）
申请年 2022（4）
专利权人 UNIV FOSHAN（4）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Composite nanofiber used as e.g. thickening agent in lubricating grease and in-situ self-repairing of micro-damages on friction surface, comprises layered silicate nanofiber, graphene and nano borate, where graphene and nano borate are adsorbed on surface and interlayer of silicate nanofiber.

ZHANG W, SHI P, JI X, WEI M, WANG H, ZHOU X, SONG Z, YAO X, YIN Y, YU H

Immune biosensor for detecting porcine epidemic diarrhea virus, has electrode substrate, graphene oxide layer, chitosan layer and porcine epidemic diarrhea virus monoclonal antibody layer, where graphene oxide layer, chitosan layer and porcine epidemic are covered on electrode base material.

SU L, HUANG Z, MA G, CHI S, WEN F, GUO J, LUO Y, LI Z

Preparing fluorinated composite anticorrosive filler for epoxy coating, involves dispersing graphene oxide in distilled water, ultrasonically processing, mixing prepared solution with fluorotitanate solution and boric acid solution, hydrothermally reacting mixed solution, washing and drying product.

CHANG M, YE X, HUANG Y, CHEN D