国家/地区
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC H01L023/373（2）
发明人 WANG W（2）
公开年
申请年 2010（2）
专利权人 WANG W（2）

Radiating device for electronic/photo-electric assembly, has glue part comprising resin and alkene or resin and carbon nanotube, where weight percent of glue part is less than or equal to resin of graphene or carbon nanotube.

WANG W

Heat dissipation device of electronic/photoelectric element using binding adhesive comprising at least resin and graphene or resin and carbon nanotube between an electronic/photoelectric element and a soaking block.

WANG W