国家/地区 中国（5）
IPC部 C（3） H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 DING T（5）
公开年 2018（3） 2017（2）
申请年 2017（5）
专利权人

Preparing a conductive plastic involves premixing graphene powder with polymer microparticles to obtain premix, mixing premix with carbon nanotube powder to obtain mixture and then subjecting mixture to extrusion granulation.

DING T, WU B, ZHU Y, LI J

Method for suppressing copper electromigration in wafer bonding, involves performing heat treatment to semiconductor substrates so that copper layer is formed by bonding graphene on copper layer.

DING T, WANG J, WANG X, LI C, GUO S, XING R, ZENG F

Surface functionalized spherical nano-silicon dioxide-graphene oxide/polymer composite tanning agent preparation involves mixing aqueous solution of polyvinyl alcohol-silicon dioxide and graphene oxide aqueous solution.

PAN H, WANG X, DING T, ZHANG J, LIU R

Preparing aldehyde-based graphene for preparing graphene composite material, involves mixing graphene with Vilsmeier reagent, heating, reflowing, subjecting to imidization reaction with Vilsmeier reagent to obtain graphene imidization.

DING T, ZHAO W, SUN Y, WU B

LED chip has P-type electrode that is provided on graphene film layer, and titanium dioxide nanorods that are arranged in array manner on graphene film layer, and whose outer surface is provided with multiple silver nanoparticles.

DING T, GE Y, GUO B, HU J, LI P, LV M