国家/地区 中国（65）
IPC部 C（28） B（20） H（12）
D（10） A（4） G（4）
F（2）
IPC大类 B01（14） C10（11） H05（7）
C01（5） D01（5） D06（5）
H01（5） C09（4） B65（3）
C02（3） G01（3） A41（2）
A61（2） B29（2） C04（2）
IPC小类 C10M（11） B01F（8） C10N（7）
H05K（7） B01D（5） C01B（5）
D01F（5） D06M（5） B65G（3）
C02F（3） C09D（3） D06C（3）
H01L（3） A41D（2） A61F（2）
IPC C10N030/06（7） D01F001/10（5） B01F007/18（4）
B01F015/02（4） H05K001/02（4） B01F013/10（3）
B01F015/00（3） C02F001/44（3） C10M169/04（3）
C10M177/00（3） C10N040/25（3） D06C007/00（3）
D06M010/02（3） D06M011/74（3） H05K001/03（3）
发明人 KANG W（65）
公开年 2017（16） 2018（10） 2020（9） 2021（8） 2022（7） 2013（6） 2023（6） 2019（2）
申请年 2017（21）  2022（11）  2019（8）  2012（6）  2020（6）  2016（5）  2021（5） 
专利权人 SICHUAN CARB.（26） HUNAN HANKUN.（8） JIANGXI LATT.（8） UNIV TIANJIN.（8）
UNIV SHAANXI.（2）

Super-hydrophilic composite material based on large current density hydrogen evolution reaction has nitrogen-doped graphene substrate, and rhodium-palladium double double-metal layered hydroxide whose surface is deposited with compound of p-methyl aniline and benzidine.

ZHU X, LI K, WANG H, KANG W, LI Z

Carbon/ceramic brake disc with sandwich structure useful for vehicle brake parts, comprises e.g. friction function layer, a mechanical function layer and a friction function layer, which are connected by mortise and tenon and carbon cloth composite layer and short fiber layer.

LI Z, CHENG K, KANG W, LI R, LI Q, HOU W, CHENG H, ZHAO D, HUANG F

Graphene radiating copper-clad ceramic circuit board for use in e.g. power electronics, has upper ceramic layer whose upper surface is concavely provided with set of recesses matched with electronic device.

GUO X, HE H, KANG W, KONG S

Ceramic substrate of universal UV package, has metal surrounding dam that is set on upper surface of ceramic main portion and located at periphery of front bonding pad, and metal surrounds dam structure that forms packaging cavity.

GUO X, HE H, KANG W, KONG S

High heat conducting DPC wall dam ceramic circuit board, has heat conducting column that is integrally formed and connected between solid crystal heat conducting plate and radiating plate.

HE H, KANG W, KONG S, GUO X

Embedded radiating type ceramic substrate for electronic device, has lower graphene layers whose lower ends are integrally connected with lower ends of heat conducting columns.

KANG W, KONG S, GUO X, HE H

Fast radiating type ceramic substrate for electronic device, has heat conducting column whose one end is integrally connected with heat conducting layer and other end extends into radiating water cavity and connected with coating graphene.

KANG W, KONG S, GUO X, HE H

Multi-layer radiating type ceramic substrate, has upper graphene radiating layer that is set on upper surface of upper ceramic base layer and integrally connected with upper end of radiating column.

GUO X, HE H, KANG W, KONG S

Ceramic substrate with high thermal conductivity, has lower graphene heat conducting layer that is set on lower surface of ceramic main portion and is integrally connected with lower end of each heat conducting column.

GUO X, HE H, KANG W, KONG S

Alumina ceramic substrate for durable packaging, has lower graphene heat conducting layer that is integrally connected with lower end of each heat conducting column and exposed on lower surface of buffer layer.

KONG S, GUO X, HE H, KANG W