国家/地区 韩国（7） 美国（4）
IPC部 C（7） B（5） H（5）
IPC大类 C01（5） H01（5） C08（4）
B32（3） B82（3） B01（2）
C09（2）
IPC小类 C01B（5） C08K（4） H01B（4）
B32B（3） B82Y（3） C08L（2）
IPC C01B031/02（4） C08K003/04（4） B82Y030/00（3）
B82Y040/00（3） C01B031/04（3） H01B001/04（3）
H01B001/24（2）
发明人 KIM J K（7）
公开年 2012（3） 2011（2）
申请年 2011（4） 
专利权人 KOREA INST SCI TECHNOLOGY（7）

Thermal conductive material for electronic packaging, is made of thermal conductive hollow particles chosen from carbon nanotube, graphene, graphite nanosheet, aluminum nitride, boron nitride and aluminum oxide, in polymer resin.

LEE S S, KIM J K, LIM S H, PARK M, KIM H, SU L S, GYEONG K J, HO I S, SUK K H

Fabricating graphene thin film involves making graphene by reducing graphene oxide using sulfonyl hydrazide-based reducing agent, forming graphene dispersed solution by dispersing graphene into organic solvent, and applying solution to film.

NA S I, KIM D Y, KOO H Y, YUN J M, YEO J S, KIM J K

Graphene-iron oxide complex, useful in purification filter for removal of heavy metals, comprises graphene and needle-like iron oxide nanoparticles grown on surface of the graphene.

KOO H Y, CHOI W S, KIM J K, YEONG G H, SAN CHOI W, GYEONG K J

Composition used for manufacturing graphene/polyimide electroconductive composites, comprises polyamic acid and graphene oxide.

LEE S H, NA S I, KU B C, KIM J K, HO L S, IN N S, CHEOL G B, GYEONG K J

Manufacture of reduced graphene oxide for manufacturing reduced graphene-polymer composite, involves treating graphite with strong acid, mixing with halogen-substituted aromatic compound and stirring.

KU B C, PARK O K, LEE S H, NA S I, JO H I, KIM J K, LEE J H, KU B, PARK O

Method for manufacturing carbon material for laminated product, involves placing carbon atom in graphene layer, forming polymer layer in graphene layer, stabilizing atom, carbonizing polymer layer, and coating solution on polymer layer.

JO H I, LEE S H, KU B C, KIM J K, KIM T W, HWANG S Y

Electroconductive particle comprising a polymer microparticle and graphene coating layer grafted on the polymer microparticle, useful in anisotropic conductive film for packaging electronic devices.

LEE S, KIM K, LIM S H, PARK M, KIM J K, KIM H, LEE H, KIM G, IM S, KIM J, KIM K H, KIM H S, YI S S, I H J, SU LEE S, SUK KIM H, JEONG LEE H, GYEONG KIM J, HO IM S, LEE S S