国家/地区 韩国（3）
IPC部 C（3）
IPC大类 C09（3） H05（2）
IPC小类 C09J（3）
IPC C09J011/04（2） C09J201/00（2） H05K007/20（2）
发明人 KIMTAEHAN（3）
公开年 2023（2）
申请年 2021（3）
专利权人 PURE MANN IN.（2）

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H