国家/地区 中国（13）
IPC部 C（12） H（5） B（3）
IPC大类 C08（7） H01（5） C09（4）
B29（2） C01（2）
IPC小类 C08K（7） C08L（6） C09D（4）
C01B（2） H01B（2） H01G（2）
IPC C08K003/04（7） C08K003/26（3） C08K003/34（3）
C08K013/04（3） C08L023/06（3） C09D007/12（3）
C08K003/36（2） C08K005/098（2） C08K005/12（2）
C08K005/1515（2） C08K007/06（2） C08K009/04（2）
C08L003/02（2） C09D167/00（2） H01G004/18（2）
发明人 KONG X（13）
公开年 2015（10） 2014（3）
申请年 2014（13）
专利权人 TONGLING XIN.（8）

Method for manufacturing carbon-metal composite, involves reacting composition with specific amount of graphene, providing carbon compound in composition, and providing carbon nanotube with carbon-metal composite.

GONG S Y, LEE S Y, CHOE H, LEE C, LI X, LI Z, CUI X, KONG X, GONG S

Thin film transistor preparation method for array substrate of display device, involves forming source and drain metal layer on graphene semiconductor layer, and forming laminated structure on base plate.

CAO Z, HE X, KONG X, YAO Q, ZHANG F, ZHANG B, GAO J, LI Z

Evaporation boat metal aluminum film graphene micro-piece, has component that is selected from specific range of titanium diboride, graphene micro-piece, copper fiber, boron nitride and nano-silver.

KONG X

Metallized film capacitor with memory function includes polypropylene random copolymer, polyethylene oxide, graphene, chloroplatinic acid, nano activated calcium carbonate, metallocene polyethylene, boron fiber, and tartaric acid.

KONG X

Ultra-high sheet resistance metallized film capacitor contains metallocene polyethylene, graphene, tetrapod-shaped zinc oxide whisker, silicon carbide whisker, magnesium borate whisker, and low-density polyethylene.

KONG X

Coating, useful for electrolytic capacitor shell, comprises macroporous resin, silicon carbide, non-crystalline quartz granule, potassium feldspar, tert-butanol, graphene, boron fiber, carbon fiber, potassium tungstate, and deionized water.

KONG X

Coating, useful in metallized film capacitor shell, comprises organic silicone resin, nanosilver, titanium pigment, polyacrylamide, fibroin, palm oil, graphene, industrial alkali, silicotungstic acid, pigment, water and lime powder.

KONG X

Encapsulating material with a reinforcing filler, useful for a thin film capacitor, comprises graphene, wood fiber, soil, chloroprene rubber, calcium carbonate, silica micro-powder, silica, sepiolite, diatomic clay, and seaweed mud.

KONG X

Radiating strong capacitor molded case comprises e.g. polyvinyl alcohol resin, modified purple clay powder, silicon nitride, peat soil, polyethylene, graphene, wood-plastic powder, chlorinated paraffin, propylene glycol and carbon fiber.

KONG X

Thin film capacitor shell oil radiation thermal coating comprises e.g. amino resin, guar gum, graphene microship, aqueous polyurethane adhesive, hydrolyzed silk protein, palm oil, olive oil, zirconium oxide, nano anion powder, and modifier.

KONG X