国家/地区 韩国（4） 台湾（2） 美国（2） 世界知识产权组织（2）
IPC部 C（4） H（4） B（3）
IPC大类 H01（4） C01（2） C25（2）
IPC小类 C01B（2） H01L（2）
IPC C01B031/04（2）
发明人 LEE C（8）
公开年 2016（8）
申请年 2015（5）  2014（3） 
专利权人 UNIV SUNGKYU.（3）

Method for producing metal chalcogenide thin film on flexible substrate, involves supplying transition metal precursor and chalcogen-containing gas onto graphene formed on substrate, so as to form metal chalcogenide thin film.

CHOI M, LEE C, KIM Y

Preparing three membered polypyrrolone/polyimide/oxidized graphene nanocomposites based on molecular assembly comprises electrostatic spinning mixed solution to obtain precursor nanofibers, drying, heating and cross linking.

FENG Y, HOU H, LEE C, ZHU J, YE W, ZHOU G

Electrochemical method for producing graphene includes putting a graphite working electrode and an auxiliary electrode in an electrolyte.

LEE C, CHEN C, LEE C L, CHEN C W

Electrode material used in electrode for lithium ion battery, comprises conductive active particles, and ionic cover layer comprising matrix of functional group-substituted polyaryletherketone and graphene particles dispersed in matrix.

CHIU K, LAI P, LEE C, LIU S, LAI B, LIU X, LI J, CHIU K F

Manufacturing method for graphene dispersed solution used in ink, involves processing graphite with ultrasonic wave in high temperature of more than sixty degrees Celsius in water, where sound pressure of sonication is one kilopascal.

CHO D H, KANG B G, KIM J, KWON S H, LEE C

Method for manufacturing camphorsulfonic acid doped polyaniline or graphene composite film for flexible super capacitor electrode, involves processing oxide graphene graphite by chemical oxidation process.

JANG J, LEE C, KIM M

Graphene hot electron nano-diode for optical detection device and energy conversion device, has electronic amplification type graphene layer, semiconductor layer forming Schottky junction with pinned layer, and electrodes.

LEE C, LEE H, LEE Y K, PARK J

Formation of complex plating film used in electronic material, involves adding graphene-coated metal powder to plating solution, and forming plating film by performing electric plating in solution to which metal powder is added.

SUH S, SONG Y, PARK J, KIM T, SON H, SHIN J, LEE M, LEE J, LEE C, CHO Y, BAEG S, AHN B, YUN S