国家/地区 韩国（3）
IPC部 C（2） H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC
发明人 LEE S S（3）
公开年 2012（2）
申请年 2011（3）
专利权人 KOREA RES IN.（2）

Thermal conductive material for electronic packaging, is made of thermal conductive hollow particles chosen from carbon nanotube, graphene, graphite nanosheet, aluminum nitride, boron nitride and aluminum oxide, in polymer resin.

LEE S S, KIM J K, LIM S H, PARK M, KIM H, SU L S, GYEONG K J, HO I S, SUK K H

Manufacture of graphene used for e.g. graphene conducting wire, for semiconductor device e.g. memory, involves controlling electrical characteristics by doping nitrogen to graphene.

LEE S S, JUNG M W, PARK B K, JEONG S J, LEE Y K, CHUNG T M, KIM C G, AN K S, SHIN Y S, JUNG D

Manufacturing method of patterned graphene used in graphene-based device, involves forming metal catalytic layer on substrate, and growing graphene layer on portion in which metal catalytic layer is not formed.

LEE S S, JUNG D S, AN K S, PARK B K, LEE Y K, KIM C G, CHUNG T M, SHIN Y S, JEONG S J