国家/地区 韩国（3） 中国（2） 台湾（2） 美国（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC H01L023/532（2） H01L027/108（2）
发明人 LIM H（3）
公开年 2022（3）
申请年 2021（3）
专利权人 SAMSUNG ELEC.（2）

Substrate for analysis of biomaterial e.g. amino acid derived from liquid biopsy, comprises liquid biopsy sample injection unit having well-shaped pattern on surface of substrate, and liquid biopsy-derived biological material containing parylene coating on surface of substrate.

KIM M S, LIM H J, LIM H

Semiconductor device has lower graphene layer which is in contact with lower surface of ruthenium wiring, and extends along lower surface of ruthenium wiring, and wiring line cap layer that extends along upper surface of ruthenium wiring.

LEE J E, LEE M J, KIM W D, SHIN H J, LEE H B, LIM H S, LEEMINJOO, LIM H, LI X, SHEN X, JIN W, LEE M, LI J

Wiring structure for use in semiconductor device, has first conductive pattern, ohmic contact pattern, oxidation prevention pattern, diffusion barrier, and second pattern sequentially stacked in stated order on substrate.

JEONG G, LEE S, YOON J, YAMAMOTO K, SHIN H, BYUN K, CHO M, LIM H, ZHENG G, LI Z, YOUN J, SHAN B, SHEN X, LIM H S, JO M, BYUN K E, SHIN H J, SU Y J, LEE S Y, JUNG K O