国家/地区 韩国（3） 美国（2）
IPC部 H（3）
IPC大类 H01（3）
IPC小类 H01L（3）
IPC H01L021/768（2） H01L027/04（2）
发明人 LIM J（3）
公开年 2013（3）
申请年 2011（3）
专利权人 UNIV YONSEI .（3） SAMSUNG ELEC.（2）

Composite, useful in graphene-polymer composite device, comprises plate shaped graphene, and polymer coating layer that is bonded to surfaces of graphene and smoothly forms bendable film shape with graphene layer.

JUN S C, PARK H G, YOUN H S, OH J Y, LIM J

Radio-frequency circuit, has graphene interconnection part for connecting electric components, and trench part formed in lower part of graphene interconnection part and arranged on insulating layer.

SHIN H J, CHOI J Y, JUN S C, KIM W K, YOON H S, OH J Y, LIM J H, SHIN H, CHOI J, JUN S, KIM W, YOON H, OH J, LIM J

Radio-frequency circuit used in semiconductor device, has graphene interconnection portion that connects first electric component with second electric component.

SHIN H J, CHOI J Y, JUN S C, KIM W K, YOON H S, OH J Y, LIM J H, SHIN H, CHOI J, JUN S, KIM W, YOON H, OH J, LIM J