国家/地区 中国（3） 美国（2） 世界知识产权组织（2）
IPC部 H（2）
IPC大类 H01（2）
IPC小类 H01L（2）
IPC H01L021/768（2）
发明人 LIN Q（4）
公开年 2013（3）
申请年 2012（4）
专利权人 INT BUSINESS.（2）

Method for forming interconnect structure for integrated microelectronic circuit, involves transferring graphene from copper foil, and patterning graphene, so that edges are coincided with vertical sidewall surfaces of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D

Interconnect structure for integrated microelectronic circuit, has graphene cap which is provided with edges that are vertically coincident with edges of copper structure.

BONILLA G, DIMITRAKOPOULOS C D, GRILL A, HANNON J B, LIN Q, NEUMAYER D A, OIDA S, OTT J A, PFEIFFER D, DIMITRAKOPOULOS C, HANNON J, NEUMAYER D, OTT J, DIMITRAKO P C D, GREER A

Forming graphene nano-medicine carrier involves adding hydrophobic anti-tumor drug in graphite nano-material aqueous solution/tumor target molecule/dopamine, ultrasonic dispersing, adjusting pH, stirring, centrifuging and separating.

LIN Q, DAI L, QU J, LIU Y, LV F, HUANG X, LIN M, LU F

Graphite alkene/tin dioxide nanocomposite resistance-type thin film gas sensor for e.g. detecting room temperature, has ceramic base body coated with sensitive film, where sensitive film is nanocomposite of graphene and tin dioxide.

LI Y, LIN Q, YANG M