国家/地区 中国（4）
IPC部 H（4）
IPC大类 H01（4）
IPC小类 H01B（4）
IPC H01B013/00（4） H01B001/22（3） H01B001/24（2）
发明人 MEN Z（4）
公开年 2021（4）
申请年 2021（3） 
专利权人 HIT ROBOT GR.（3）

Conductive slurry useful for printing circuit and electromagnetic shielding field, comprises binder, dispersant, defoamer, conductive filler and diluent.

MEN Z, HAN Z, SONG Q

Preparing low-silver aqueous conductive silver paste for e.g. polyethylene terephthalate film, involves ball-milling adhesive, defoaming agent, dispersant and non-metal conductive powder to obtain dispersion liquid, adding silver powder to disperse to obtain slurry, and defoaming.

MEN Z, HAN Z, SONG Q

Preparing aqueous conductive paste material involves mixing and grinding deionized water and conductive synergist to obtain slurry A, mixing and grinding aqueous emulsion, antifoaming agent, dispersing agent and conductive carbon powder to obtain slurry B.

SONG Q, HAN Z, MEN Z

Liquid metal conductive paste for forming conductive circuit, comprises conductive powder, base resin, solvent, additive, and liquid metal solid-loaded powder comprising liquid metal liquid drop and solid powder coated outside liquid drop.

MEN Z, DONG S