国家/地区 韩国（5） 中国（3）
IPC部 C（5） B（3） H（2）
IPC大类 C08（3） H05（2）
IPC小类 C08K（3） C08L（2） H05K（2）
IPC H05K007/20（2）
发明人 PARK M（5）
公开年 2023（3） 2022（2）
申请年 2021（5）
专利权人 INNOX ADVANC.（3）

Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Heat dissipation sheet useful for display component comprises heat dissipation layer formed of polymer sheet containing graphene particles, and first adhesive layer located on top of heat dissipation layer.

YOO T H, LEE J, JOH B J, PARK M W, PARK M, CHO B, LIU T

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Ink composition for security printing, and used in manufacture of security indicia, comprises dielectric matrix having hydroxyl group, graphene quantum dots dispersed in dielectric matrix, and graphene quantum dot composite having afterglow properties emitting phosphorescence at room temperature.

JEON S, PARK M, WOO J, PARK M S

Biodegradable composite resin composition used for forming molded product, comprises polybutylene adipate-co-terephthalate, modified starch, rice powder, natural plasticizers, and natural reinforcing agents comprising nanochitin and nanocellulose.

PARK J M, CHOISOONHO, PARK M