国家/地区 中国（4） 韩国（2） 美国（2）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4） F28D（2） H05K（2）
IPC B32B003/26（4）
发明人
公开年 2022（3）
申请年 2021（4）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Heat storage ceramic tile, has ceramic tile main body whose top part is provided with ceramic surface skid-proof layer, and heat storage layer whose inner part provided with thermocouple and other side provided with telescopic hole.

WANG Y, ZHANG H, SHENG Y

Sealing pad of composite cylinder cover for sealing between cylinder cover and cylinder housing, has core plate and composite material plate that are formed with sealing weld bead at boundary position.

LUO Z