国家/地区 美国（3）
IPC部 B（3）
IPC大类 B32（3）
IPC小类 B32B（3） C01B（2） C08J（2）
IPC B32B009/00（3）
发明人
公开年
申请年 2015（2） 
专利权人

Composite prepreg material for manufacturing e.g. aerospace components, has several layers of graphene film functionalized with holes, amine and/or epoxide, having size that spans entire width and entire length of prepreg material.

HUMFELD K D

Transferring of graphene to polymeric substrate for device substrate preparation involves heating polymeric substrate to partially melt polymeric substrate, compressing partially melted polymeric substrate against graphene, and cooling.

MACEDO F G J, OZYILMAZ B, CASTRO A H, MARTIN F I

Thermal radiation film for e.g. electronic devices comprises heat-transfer layer formed by uniformly dispersed graphene microparticles and carbon nanotube.

KAGAWA S, SEIJI K