国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08G（5） C09J（4） C08K（2）
C09D（2）
IPC C08G018/48（5）
发明人
公开年 2023（5）
申请年 2022（3）  2023（2） 
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Single-component thermally conductive hot-melt polyurethane adhesive useful in electronic products comprises polyester polyol, polyether polyol, heat-conducting medium, flame-retardant medium, isocyanate and additive.

CHEN Z

Graphene composite foam useful e.g. in insole, comprises highly reactive polyether polyol, polymer polyol, modified graphene, silicone oil, crosslinking agent, foaming agent, catalyst, flame complex agent and foam stabilizer, and its surface is covered with polyurethane waterproof film.

FANG M, CHEN Y, CHEN M, LIN F

Water-blocking material for sealing openings of heat-insulating materials used for preparing structure, comprises components polysiloxane, polyether polyol isocyanate, polyolefin polyol, curing agent, catalyst, defoamer, and filler.

HU B, LIU Y, HE W, NI X, PAN Z, ZHANG S, WANG T