国家/地区 中国（3）
IPC部 B（4）
IPC大类 C08（4）
IPC小类 C08G（4） C08K（3） C08L（3）
B32B（2） C09D（2）
IPC C08G059/62（4）
发明人
公开年
申请年 2022（2） 
专利权人

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Solvent-free epoxy self-repairing anticorrosive coating used as an anticorrosive coating on carbon steel substrates, comprises component A and component B, and the component A includes phenolic epoxy resin and graphene dispersion slurry.

SHI J, GUO X, HAN Z, CUI C, WANG L, DING C, KANG S, SUN Z, LIU B, DUAN S

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S