国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08J（5）
IPC C08J005/24（5）
发明人 LIU S（5）
公开年 2021（3）
申请年 2020（3） 
专利权人 UNIV SOUTH C.（4）

Preparing continuous fiber reinforced aromatic polyimide 3D printing thermal conductive composite material comprises e.g. impregnating continuous fiber filaments or tapes in aromatic polyimide prepolymer/thermal conductive filler, adjusting glue content and ribbon shape, curing resin.

LIU S, ZHAO J, LI L, YUAN Y

Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises e.g. dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent, impregnating continuous fibers, then hot-pressing.

ZHAO J, LIU S, WANG Z, YUAN Y

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Preparation of discontinuous fiber-reinforced polyhexahydrotriazine resin-based thermally-conductive composite material involves prepolymerizing formaldehyde and aromatic amine, mixing with discontinuous fibers to obtain prepreg, and curing.

YUAN Y, MA Y, ZHAO J, LIU S

Preparing continuous fiber reinforced polyhexahydrotriazine resin-based thermally conductive composite material e.g. comprises dissolving formaldehyde and aromatic amine in water/non-proton solvent mixed solution and then pre-polymerizing.

YUAN Y, MA Y, ZHAO J, LIU S