国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） B32（2）
IPC小类 C08J（3） C08K（3） C08L（3）
B32B（2）
IPC C08K003/04（3）
发明人 WU H（3）
公开年 2022（2）
申请年 2022（3）
专利权人 JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Sheet molding compound material useful in e.g. chemical industry, comprises first component comprising glass fiber, and second component e.g. matrix resin, graphene, elastomer low shrinkage additive, inorganic filler, curing agent, internal release agent, mill base and thickening agent.

SUN P, HU L, WU H, CHEN Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y