国家/地区 台湾（5）
IPC部 C（5）
IPC大类 C08（5） C09（3） B32（2）
B60（2） B82（2） C01（2）
H05（2）
IPC小类 C08J（5）
IPC C08L009/00（5）
发明人
公开年 2021（5）
申请年 2020（3）  2021（2） 
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Acrylic metal salt composition for resin composition, is prepared by making acrylic acid, divalent metal oxide, and thermally conductive powder in non-polar solvent, and removing solvent to obtain metal acrylate composition.

TSOU C P, CHIU K, CHEN Z, HUANG T T, HUANG T, TSOU C

Composite particles used for forming elastomeric formulation used in tire components such as vehicle tire treads, subtreads, tire carcasses, tire sidewalls, tire belt wedge, and tire wire skim coats, comprise silica, and graphene carbon.

DOS SANTOS FREIRE L, DING Q, KUTCHKO C, PAN S, SILVERNAIL N J, DOS SANTOS F L, LUCAS D S S, DINGCHI, PANSHUYANG, NATJJ S N