国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4） H05（3） B32（2）
IPC小类 C08K（4）
IPC C08L009/00（4）
发明人 WU Y（2）
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Special cable useful for bending torsion resistant mechanical arm comprises flexible rubber sleeve located between silicone rubber outer and inner sheath layer and graphene filling layer filled between conductor wires.

YANG Z, HU J, HE Y, HU X, WU Y, ZHU G, HAN G, WANG Y

Preparing bending-resistant composite radiating film comprises e.g. taking graphite oxide aqueous solution, firstly adding radiating filler, stirring uniformly, then adding emulsifier and stirring until emulsifier is completely dissolved.

LIN Y, LI X, ZHANG Y, YANG X