国家/地区 中国（6） 美国（2）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7） C08L（7） C08J（5）
E04F（4） B32B（3） C09D（2）
E04B（2） E04H（2）
IPC C08L063/00（7）
发明人
公开年 2021（3） 2022（2）
申请年 2020（3） 
专利权人

Epoxy resin geothermal floor useful in the technical field of building decoration materials, comprises surface decoration layer, epoxy resin board layer composed of glass fiber powder, carbon fiber, methylene diphenyl diisocyanate, cured epoxy resin fiber and dispersants and moisture-proof layer.

ZHAO B, WU M, DENG Y, GONG H, JIANG Z, WANG S, TANG Z

Resin composition used for forming composite material for forming fiberglass reinforced resin used for forming laminate for forming e.g. swimming pool or spa pool, comprises one or more curable resins, graphene, one or more milling media, and milled fiberglass.

BEALE L J

Preparing improved thermal insulation graphene floor heating film comprises e.g. coating on leveled ground to form base film after leveling construction ground, and base film is hollow titanium oxide powder, and main material of base film.

YU J, FENG X

Heat transfer flame-retardant graphene thermal conductive plate comprises bottom layer, support layer and surface decoration layer and heating member.

YU Q, ZHANG D, LIU G, ZHOU L, DONG H, LV D, YAO D, LIU X, GONG X

Lightweight and impact-resistant maintenance cabin board useful for vehicle maintenance, comprises an upper deck of graphene oxide modified carbon fiber-resin complex material and lower deck that of graphene reinforced metal material.

ZHU M

Graphene antistatic electrical misfire grindstone useful in areas having high requirements for antistatic and mechanical strength, comprises e.g. graphene oxide, polypropylene, adhesive, acrylic resin, acetylene black and diluent.

ZHANG C

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN