国家/地区 中国（2） 日本（2） 美国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2012（3）
申请年 2012（2） 
专利权人

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G

Manufacture of silica nanoparticle-grafted graphene oxide-modified epoxy resin condensate, involves adding silica nanoparticle-grafted graphene oxide to epoxy resin substrate, decompressing, adding curing agent, curing and molding.

LEE S, LING R, LIU K, LU S, QI B, XU X