国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） H05（3）
IPC小类 C08K（3）
IPC C08L063/02（3）
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J