国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4） H05（2）
IPC小类 C08K（4） C08L（4） C08J（2）
H05K（2）
IPC C08L063/02（4）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing nanocellulose/graphene/epoxy resin composite material, comprises e.g. dispersing graphene into aqueous solution of nanocellulose nanocrystals, performing high-speed shear dispersion, adding nanocellulose fiber slurry into it, dispersing, drying, infiltrating it, and curing.

YAO J, LIU H, ZHOU L, WANG F

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J