国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08L（5） C08K（3） C09K（3）
C08J（2） C09D（2）
IPC C08L069/00（5）
发明人
公开年 2021（3） 2022（2）
申请年 2021（5）
专利权人

Low dielectric and high heat conducting interface film comprises a substrate and a radiating layer comprised of organic polymer, boron nitride powder, silicon dioxide, bonding agent, reinforcing agent, dispersant, polyethylene wax and ethanol solution.

PAN F, LI H, ZHANG S, WU P, WANG H, LIAO X, YANG Y, REN Z

High thermal conductivity thermoplastic material comprises thermoplastic resin, tackifying resin, metal filler, ceramic filler, graphene microplates, flame retardant and elastic filler.

MAO G

High molecular screen packaging protective film comprises base material film layer and functional film layer orderly set from inside to outside, the functional film layer is film-forming solution and antistatic fiber and antistatic fiber is uniformly dispersed in film-forming solution.

CHEN S

Preparing thermally conductive composite material useful in radiating field of electronic device, comprises e.g. obtaining three-dimensional porous graphene by laser processing polybenzoxazine resin, casting polymer fluid, and curing.

ZHAO W, LIU X, YU W, JIANG Y

Electronic material composition having balanced performance comprises e.g. heat-resistant polyethylene, mesoporous silicon dioxide, polypyrrole, conductive carbon black, N-phenylmaleimide, heat conducting filler and antioxidant.

SHAO T, ZHANG F, DONG J, WANG X