国家/地区 中国（5） 世界知识产权组织（2）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5） C08L（5） C08J（4）
H05K（4） C09K（3） C09D（2）
H01L（2）
IPC C08L083/04（5）
发明人 WANG N（2）
公开年 2020（2） 2021（2）
申请年 2020（5）
专利权人

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Improved chlorinated polyvinyl chloride power pipe comprises chlorinated polyvinyl chloride, graphene A, carbon black, coupling agent, toughening agent, compatibilizer, composite lubricant, antioxidant, and titanium dioxide.

LIU G, WANG C

Silicone insulating gasket includes a thermally conductive silica gel base layer and a graphene dispersion liquid, and top surface and bottom surface of thermally conductive silica gel base layer are coated with graphene dispersion liquid.

ZHANG Y