国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08L083/07（5）
发明人
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Preparation of electromagnetic shielding composite material used in highly integrated microcircuit electronic devices, involves mixing and stirring uncured silicone rubber liquid with chopped carbon fibers, defoaming, pouring in iron mold, and curing reacting.

DONG Y, XU L, NI Q

Two-dimensional graphene/liquid metal (gallium-indium)/polydimethylsiloxane composite film useful as thermal conductive packaging material in 5G communication equipment, comprises flexible poly(dimethylsiloxane) substrate, graphene dispersion liquid and liquid metal (gallium-indium).

LUO Z, XU Z, JIANG Y

Thermally conductive wave absorbing silicone rubber composite material for use in the field of electronic communication, comprises vinyl silicone oil, hydrogenated silicone oil, graphene aerogel, ferrite powder, metal supported inorganic thermally conductive powders, platinum catalyst and inhibitors.

JIANG X, LIU W, GUO J