国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08L（5） C08K（4） C09D（2）
IPC C08L083/07（5）
发明人 LI H（5）
公开年 2022（3） 2021（2）
申请年 2021（2）  2022（2） 
专利权人

Conductive repair solution for repairing cable buffer layer ablation failure, comprises component-A (comprised of e.g. cunductive filler, catalyst, surfactant, nano copper silicide, and boron nitride) and component-B (comprised of vinyl silicone oil, thickening agent, and antifoaming agent).

LI H, RUAN Y, ZHANG F, ZHANG G, SHI Y, HAN Z, LI M, HUANG J

Wave-absorbing heat-conducting gasket useful in thermal interface material and electronic equipment, prepared into aerogel by constructing three-dimensional thermal conduction path by directional freezing of liquid nitrogen and prepared by pouring liquid silicone rubber.

LI H, DONG B

Addition-curable two-component high-stability thermal conductive silicone composition comprises e.g. silicone resin, filler e.g. nano-alumina, substituted silicon compound, water, catalyst e.g. peroxide catalyst and inhibitor e.g. 1-ethynyl-1-cyclohexanol.

LI Z, LI H, ZHANG H, LUO Y, TANG H

Composite material with water vapor barrier function comprises silicone rubber substrate layer surface provided with decorative layer, modified layer surface provided with pit provided with hydrophilic polymer particles comprising e.g. polyacrylic acid and polyvinyl alcohol.

SHANG Y, LU S, CHEN G, LI H, YANG X, ZENG W, MEI J, ZHAN H, PAN J, HE Z

Solid silicone resin composite used as LED bracket packaging material, contains vinyl-containing polysiloxane, high-reflectivity filler, high-thermal conductivity filler, solid filler, initiator, stress modifier, and adhesion promoter.

WANG R, ZHANG C, LIU Z, LI H, WANG S