国家/地区 美国（5）
IPC部 B（5）
IPC大类 C08（5） C09（3） B05（2）
B32（2） H01（2）
IPC小类 C08L（5） C08K（4） C08G（3）
C08J（3） B05D（2） B32B（2）
C09D（2）
IPC C08L101/02（5）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Aqueous composition used to form coat on substrate and antimicrobial coat, comprises cationic polyelectrolyte, anionic polyelectrolyte, nanostructures and crosslinking agent.

GUIN T C

Graphene dispersion used for manufacturing graphene-ionic liquid polymer composite, comprises graphite dispersed in ionic liquid.

SUH K S, KIM J E, KIM T Y, KIM J, KIM T

Product comprises shape memory polymer material and graphene material incorporated into the shape memory polymer material to form a polymer system.

CHENG Y T, XIAO X, XIE T, SHAW X