国家/地区 印度（3）
IPC部 C（3）
IPC大类 C09（3） G01（2） H01（2）
H05（2）
IPC小类 C09D（3）
IPC C09D007/61（3）
发明人
公开年 2021（3）
申请年 2019（2） 
专利权人

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Material used for forming coating film, comprises paste containing pigment dispersion resin containing polar functional group and electroconductive pigment having preset average primary particle diameter, and metal-containing particles.

IWATA N, ICHI Y, TSUKAMOTO A

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E