国家/地区 日本（7）
IPC部 C（7） B（3） H（3）
IPC大类 C09（7） C08（4） H01（3）
B32（2）
IPC小类 C09D（7）
IPC C09D007/61（7）
发明人
公开年 2022（4） 2023（3）
申请年 2022（7）
专利权人

Carbon material dispersion liquid used for forming coating material, comprises carbon black, carbon fiber, graphite, graphene, water, and polymer dispersant comprising polymer block with structural units derived from acrylonitrile and methacrylic acid.

SHIMANAKA H, MURAKAMI K, DOI S, SHIMOOKA R, UMEDA D, KANEKO S, GOTO J

Powder coating composition used for forming film used as surface layer for laminate and coated article, comprises fluorine-containing ethylenic polymer, and conductive material which is at least partially carbon nanotubes.

HONDA A, IMADA H, MIYATANI T, NAKATANI Y, HONDA Y

Producing food packaging barrier film used for consumers to clearly see content of packaged goods, involves providing base film, depositing inorganic laminated film on surface of base film, where inorganic laminated film includes at least one first and second inorganic material deposition layer.

CHEN C, TSAO C, LIAO T, LIAO T C, TSAO C C, CHEN C H, CHEN Z, CAO J, LIAO D

Manufacturing conductive pigment paste includes dispersing paste containing pigment dispersion resin, conductive pigment and solvent by at least one disperser selected from bead mills, homogenizers, ultrasonic dispersers, kneaders, extruders, and planetary mixers.

ENDO K, HASHIMURA M, KITAMURA T, YUKAWA Y, YUGAWA Y

Paste for reference electrode used in biosensor, comprises mixture of silver chloride powder and carbon-based conductive material.

KANG Y J, JEONG I S, PARK C H, KIM S J, PARK Y B, PARK Y, KIM S, PARK C, JEONG I, KANG Y, CHONG I, JUN K S, CHEON I S

Conductive polymer composition used for forming film, comprises polythiophene containing at least two structural units and carbon material.

KUDO K, KAWAKAMI J, SENNO Y

Powder coating composition used in manufacturing coating film which used in cookware such as frying pans, rice cookers, comprises first hot-melt fluoro resin particles which filler is dispersed in particles, second hot-melt fluoro resin particles and charge controlling agent particles.

NAKAZAWA R, TAKEYAMA M, PHAM H, KAMEYAMA S, PHAM H N