国家/地区 中国（2） 欧洲专利局（EPO）（2） 日本（2） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C01（3）
IPC小类 C01B（3）
IPC C09D201/00（3）
发明人
公开年
申请年
专利权人

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Manufacture of graphene used for manufacture of graphene junction, involves applying load to aggregated-form graphite particles, such that interlayer bonding of all graphite crystals of aggregated-form graphite particles is destroyed.

KOBAYASHI H