国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C09J（5） C08G（4） C08L（2）
IPC C09J009/02（5）
发明人 DENG X（2） LI H（2） LIU J（2）
WANG Y（2） WU X（2） XU X（2）
ZHA Y（2）
公开年 2021（5）
申请年 2020（2）  2021（2） 
专利权人 CHANGZHOU SH.（2）

Electronic adhesive for packaging graphene-based semiconductor chips, comprises epoxy resin, reactive diluent, two-component curing agent, accelerator, coupling agent, aminated graphene oxide, one-dimensional carbon nanotubes, and composite powder comprising sheet and spherical silver powders.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Weather-resistant high heat-conducting graphene based epoxy resin adhesive comprises epoxy resin, reaction diluent, double-component curing agent, accelerator, coupling agent, aminated graphene oxide and tin-bismuth alloy nano particles.

WANG Y, LI H, ZHA Y, XU X, WU X, LIU J, DENG X

Electroconductive composition used as interconnection material to connect solar cells into photovoltaic module, comprises silicone resin, silicone crosslinker, electroconductive particles, solvent, adhesion promoter, catalyst, and inhibitor.

HENCKENS A, THEUNISSEN E, YANG J, ZHANG Y, CHEN Y

New aniline compound used as bio-based alcohol-soluble self-healing electromagnetic shielding adhesive for sixth-generation electronic products.

LI N, YE L, LI J, WANG L, YIN P, LIN X, LIU Y, KANG D, GU F

Ultra-thin composite adhesive film comprises graphene heat dissipation layer, substrate layer, first metal layer and colloid layer stacked in sequence, second metal located between graphene heat dissipation layer and substrate layer.

LI L, LIANG C