国家/地区 中国（2）
IPC部 C（3）
IPC大类 C08（3）
IPC小类 C09J（3） C08J（2） C08K（2）
C08L（2）
IPC C09J183/04（3）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Adhesive tape used for fixing flexible circuit board comprises release film, first adhesive layer (e.g. tripropylene glycol diacrylate), base material layer (polyethylene terephthalate polyester slice), second adhesive layer (acrylate and maleated rosin), and foam layer (polyethylene particles).

GUO Y

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K

Preparation of industrial silicone sealant involves adding alpha,omega-dihydroxy polydimethylsiloxane, flame retardant and high-temperature-resistant filler, kneading, adding crosslinking agent, catalyst and coupling agent, and stirring.

WANG B, LUO W, CHEN H, DENG G, LI C, HUANG R, LIANG Q, YANG X, WANG L, REN C